Agenda
(preliminary)

San Jose & Austin

  • Registration & Continental Breakfast
  • Morning General Session:
    • Corporate Overview & Business Update
    • Design Overview & Outlook
    • Technology Overview & Outlook
    • A New Manufacturing Paradigm
    • Keynote Address
  • Lunch (hosted)
  • Afternoon Breakout Sessions (San Jose):
    • Technology Track 1
      • Advanced Technology for Low Power/Mobile Applications
      • Advanced Technology for High Performance Applications
      • Advanced Technology for SoC Design
      • Advanced Packaging and SIP Technology
    • Technology Track 2
      • New Mainstream Technology Offerings
      • Embedded Non-Volatile Memory
      • Ultra High Voltage and Power IC Technology Platform
      • Technology for MEMs & Automotive Applications
    • Design Technology Track
      • Design Infrastructure
      • SoC Design Flows
      • Design for Manufacturing
    • Value-Added Service Track
      • Service Platforms & Outlook – Packaging, Testing,
        Failure Analysis & New Offerings
      • Prototyping and MLM Services
      • Mask Services
  • Afternoon Sessions (Austin):
    • Advanced Technology for Low Power/Mobile Applications
    • Advanced Technology for High Performance Applications
    • Design for Manufacturing
    • Advanced Technology for SoC Design
    • Embedded Non-Volatile Memory
    • Ultra High Voltage and Power IC Technology Platform
  • Cocktail Reception (hosted)

Boston

  • Registration & Continental Breakfast
  • General Sessions:
    • Corporate Overview & Business Update
    • Design Overview & Outlook
    • Technology Overview & Outlook
    • A New Manufacturing Paradigm
    • Advanced Technology for Low Power/Mobile Applications
    • Advanced Technology for SoC Design
    • Mainstream Technology Overview & New Offerings
    • Design for Manufacturing
  • Lunch (hosted)